Advanced Signal Integrity for High-Speed Digital Designs
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Average customer review:Product Description
A synergistic approach to signal integrity for high-speed digital design
This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital design—creating the optimal combination between theory and practical applications.
Following an introduction to the importance of signal integrity, chapter coverage includes:
- Electromagnetic fundamentals for signal integrity
-
Transmission line fundamentals
-
Crosstalk
-
Non-ideal conductor models, including surface roughness and frequency-dependent inductance
-
Frequency-dependent properties of dielectrics
-
Differential signaling
-
Mathematical requirements of physical channels
-
S-parameters for digital engineers
-
Non-ideal return paths and via resonance
-
I/O circuits and models
-
Equalization
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Modeling and budgeting of timing jitter and noise
-
System analysis using response surface modeling
Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material. Advanced Signal Integrity for High-Speed Digital Designs is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.
Product Details
- Amazon Sales Rank: #239138 in Books
- Published on: 2009-03-16
- Original language: English
- Number of items: 1
- Binding: Hardcover
- 660 pages
Editorial Reviews
From the Back Cover
A synergistic approach to signal integrity for high-speed digital design
This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital design—creating the optimal combination between theory and practical applications.
Following an introduction to the importance of signal integrity, chapter coverage includes:
- Electromagnetic fundamentals for signal integrity
Transmission line fundamentals
Crosstalk
Non-ideal conductor models, including surface roughness and frequency-dependent inductance
Frequency-dependent properties of dielectrics
Differential signaling
Mathematical requirements of physical channels
S-parameters for digital engineers
Non-ideal return paths and via resonance
I/O circuits and models
Equalization
Modeling and budgeting of timing jitter and noise
System analysis using response surface modeling
Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material. Advanced Signal Integrity for High-Speed Digital Designs is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.
About the Author
STEPHEN H. HALL is a Senior Staff Engineer at Intel Corporation, where he leads a team focused on the research of new modeling and measurement solutions for channel speeds as high as 30Gb/sec. Previously at Intel, he was the lead designer for desktop and server buses on Pentium® II, III, and IV based systems, coordinated research in the area of high-speed signaling with multiple universities, led research and development teams in the area of high-speed modeling, and taught signal integrity courses to engineers in two countries. He is also the author of High-Speed Digital System Design (Wiley).
HOWARD L. HECK is a Principal Engineer at Intel Corporation, where he leads development of the signaling specifications and solutions for USB 3.0. He also teaches high-speed digital interconnect design at the Oregon Graduate Institute, is a Senior Member of the IEEE, and holds five patents in the area of high-performance packaging and interconnects, with five more pending.
Customer Reviews
An excellent and timely summary of signal integrity issues
Heck and Hall have done a fantastic job in summarizing both the theory and practice of solving today's SI issues. The math behind topics such as linear network theory, frequency-dependent dielectric effects and filter design for equalization is rigorous, yet ample space is set aside for practical guidance as well. Of particular note is their thorough treatment of hot PCB SI topics as dielectric loss and surface roughness modeling, and preservation of causality in transmission line models. Transmitter and receiver equalization (DFE and CTLE) are well-described, as are analysis techniques such as peak distortion and bit-error rate. Finally, their summary of response surface modeling (RSM) approaches to desgn of experiments (DOE) is perhaps the first and certainly the most comprehensive overview of those methods as applied to PCB SI design available today. A book well worth purchasing if you are involved in SI modeling, SI simulation or PCB design.




