Product Description

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.

Product Details

• Amazon Sales Rank: #987283 in Books
• Published on: 2007-12-17
• Original language: English
• Number of items: 1
• Binding: Hardcover
• 475 pages

Review
"I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both." - George Riley

About the Author
James J. Licari is President of AvanTeco, Whittier, CA, and a consultant on materials and processes for microelectronics. Prior to this, he was Chief Scientist for Hughes’ Microelectronics Division in Newport Beach, CA, where he led the development of high-density, high-performance multichip modules for high reliability military and space applications. Dr. Licari is internationally recognized for his contributions to the microelectronics field, particularly in the development of materials and processes for interconnecting and packaging hybrid microcircuits and multichip modules. He is the recipient of six NASA awards, the annual Technical Achievement Award from IMAPS, and the Materials Engineer of the Year Award from NEPCON. Licari is also the author of four books and over 100 publications and has lectured at UCLA, Jet Propulsion Laboratories, and Oxford University, among others.

Dale W. Swanson is an Engineering Specialist in the Materials and Processes Laboratory at Boeing Integrated Defense Systems in Anaheim, California. Mr Swanson has over 20 years experience in materials and process engineering for electronic applications including printed-wiring boards, hybrid microcircuits and multichip modules, reliability for single-chip integrated-circuit packaging, and specialty applications such as rapid in-line curing for high-throughput surface-mount applications. Mr. Swanson has authored more than 20 technical publications and white papers. He was inducted into the Boeing Technical Fellowship in 2001 as an Associate Technical Fellow for adhesives in electronic applications.

Customer Reviews

Industry guru shares the location of the secret elephant burial ground
I thought I knew everything about adhesives for electronics, but this book covers everything and then some. A must have for industry professionals

Getting stuck with the right adhesives.
"Adhesives Technology for Electronic Applications" is the first book dedicated exclusively to the electronic applications of adhesives. It leaves no need for another such book, at least until this generation gives way to nano or other adhesives. It is many books in one: textbook, handbook, reference book, catalog, history book. Together, all exhaustively cover the what, why, and how of electronics adhesives.

First, the history traces the development of adhesives for electronics assembly through four generations, beginning in the 1960's, revealing the problems encountered and solved as adhesive chemistry grew more sophisticated.

The textbook follows, providing the physics and chemistry foundations in a theory of how adhesives work. The four main functions of electronics adhesives, adhesion, electrical conductivity, heat transfer, and stress control, are examined sequentially. The chemistry chapter details the formulations and properties of eight major adhesive families used in electronics. For the chemically competent, this may be a well-structured refresher.

Past these textbook underpinnings, the handbook/catalog begins with the chapter on bonding manufacturing processes. This longest chapter (93 pages, 25 tables) follows the factory production flow, from pre-cleaning to final curing, and, alas, rework. Material, equipment, and processes are extensively covered, both with tables of generic information and examples of commercial products and their features, by supplier and model number.

The reference book takes a different useful viewpoint, examining all the major adhesive end-use applications. It illustrates how different requirements logically lead to different adhesive solutions. The message is clear: in the world of adhesives, one size doesn't fit all.

The concluding two chapters, on reliability and on testing, are a logical pair, sharing tables of specifications, test methods, and examples of test results. One useful table lists the sources for many government and commercial specifications and standards.

Overall, the book judiciously mixes clear explanations with extensive tabular information and more than 400 literature references. Having no index to the 76 tables is a minor annoyance. However, frequent users will no doubt bookmark their most-used tables

I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both.